Novram
Novram
High-efficiency thermal modules configured for high-density 1U/2U rack servers, offering ultra-low thermal resistance and continuous operation in challenging ambient climates.
Providing industrial-grade heat dissipation solutions backed by strict manufacturing methodologies and empirical thermal laboratory testing.
As the economic epicenter of the Haut-Sassandra region in Côte d’Ivoire, Daloa is rapidly expanding beyond its traditional agricultural dominance into a key digital and logistical crossroads. The ongoing modernization of cocoa supply chain telematics, regional banking networks, and government data initiatives has spurred an unprecedented demand for reliable edge server installations and localized data center nodes across Daloa.
Deploying server infrastructure in West African tropical climates presents distinct thermal engineering challenges. Facilities in Daloa frequently operate in high ambient temperatures (exceeding 38°C to 42°C in non-air-conditioned enclosures) coupled with seasonal humidity variations and airborne particulate matter. Standard off-the-shelf radiators often suffer from rapid thermal saturation, resulting in CPU throttling, system instability, and high operational costs.
Understanding the physics of heat dissipation: How micro-channel copper bases, vapor chambers, and skived fins deliver ultimate reliability under heavy server loads.
Our server radiators utilize high-purity sintered copper powder capillary heat pipes. This design accelerates phase-change liquid-to-vapor cycling, transferring thermal energy away from the CPU die with zero gravity-orientation dependency.
By engineering high-density aluminum and copper fin stacks with automated reflow soldering, we maximize the total surface dissipation area within compact 1U, 2U, and 4U rack chassis constraints.
For high-power computing (HPC) nodes exceeding 350W TDP, our direct-to-chip copper liquid cold plates provide superior thermal conductivity, enabling data centers in Daloa to achieve target Power Usage Effectiveness (PUE) below 1.3.
| Cooling Architecture | TDP Capacity | Tropical Ambient Suitability | Maintenance Requirement | Target Rack Density |
|---|---|---|---|---|
| 1U/2U Air Cooling Heat Pipe | 95W - 300W | High (Dust Resistant) | Low (Periodic Fan Clean) | Standard Rack Units (1U-4U) |
| Vapor Chamber (VC) Air Cooling | 200W - 350W | Very High | Low | High-Density Edge Nodes |
| Direct-to-Chip (D2C) Liquid Block | 300W - 500W+ | Extreme (Independent of Air) | Medium (Coolant Loop Checks) | Ultra-Dense AI & Cloud Racks |
Novram Electronics Co., Ltd. is a world-class hardware thermal management and DDR5 memory module manufacturer based in Shenzhen, China, supplying high-performance computing hardware to enterprise, OEM, and ODM clients across the globe.
Established in 2016, Novram operates a state-of-the-art 3,860㎡ manufacturing facility equipped with automated SMT assembly lines, CNC machining centers, vacuum brazing furnaces, and advanced thermal testing chambers. Over 9 years of industry expertise and 7 years of international export footprint enable us to deliver server radiators and memory components to partners in over 40 countries, generating an annual export revenue of US$18.6 million.
Quality control is embedded in every stage of production. Supported by 42 dedicated QC inspectors and 76 R&D thermal engineers, our factory launches approximately 138 new custom products annually, backed by partnerships with over 860 qualified component suppliers worldwide.
Engineered to support Intel Xeon Scalable (LGA4677, LGA4189, LGA3647) and AMD EPYC (SP6, SP3) processors for high-density enterprise server racks in Daloa and global installations.
Designed for ultra-dense AMD EPYC & Intel Xeon socket architectures requiring dedicated high-CFM active cooling and custom mounting backplates.
Navigating hardware procurement in West Africa requires guaranteed regulatory compliance and optimized shipping routes. Novram Electronics maintains complete product certifications including CE, FCC, and RoHS, ensuring smooth customs clearance through Port Autonome d'Abidjan and accelerated freight transport to regional data hubs in Daloa.
We provide localized OEM/ODM support for IT integrators in Daloa, offering customized thermal interface materials (TIM), backplate adjustments, and pre-applied thermal paste to reduce assembly time on site.
As CPU TDP ratings approach 500W+ with AI workload acceleration, our R&D center in Shenzhen is pioneering advanced phase-change material (PCM) integration, 3D vapor chambers, and ultra-micro-channel cold plates.
Our commitment is to empower data infrastructure operators in Daloa and sub-Saharan Africa with future-proof, energy-efficient thermal components that reduce total cost of ownership (TCO) and maximize uptime.
Essential insights regarding server radiator selection, factory customization, and delivery options for the Daloa market.
Daloa experiences high ambient temperatures and dusty operational environments. Standard radiators can quickly overheat under continuous enterprise server loads. Our server radiators are built with high-density sintered heat pipes and dust-resistant fin spacing to maintain efficient cooling at up to 45°C ambient air intake.
We manufacture server radiators for a full range of socket architectures, including Intel LGA1700, LGA115X, LGA3647, LGA4189, LGA4677, LGA4926, as well as AMD SP3, SP6, and BGA platforms.
Yes. Supported by 76 R&D engineers, we provide complete OEM/ODM services, including customized heat pipe routing, modified copper base dimensions, customized mounting brackets, private label logo engraving, and specialized thermal paste application.
Standard samples ship within 3-5 business days. Bulk factory orders are typically fulfilled in 2-3 weeks, with direct air freight options to Abidjan Felix Houphouet-Boigny Airport followed by expedited land transit to Daloa.
Partner with Novram Electronics for industrial-grade server radiators, customized liquid cooling blocks, and high-performance hardware thermal solutions.
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