Novram
Novram
Engineered for extreme thermal cycling, high density interconnect environments, and robust electronic systems.
Slovakia has established itself as the world's largest car producer per capita, anchoring the European automotive corridor with key facilities operated by Volkswagen in Bratislava, Stellantis in Trnava, Jaguar Land Rover in Nitra, and Kia in Žilina. This concentration of automotive manufacturing, paired with a rising wave of Industry 4.0 automation, demands exceptionally robust electronic systems.
As the automotive sector transitions rapidly toward electrification (EVs, hybrid power architectures, and autonomous driving assistance systems - ADAS), the thermal thresholds of control units, high-power converters, and charging stations are reaching unprecedented limits. Standard FR-4 PCB substrates simply cannot handle the persistent heat dissipation and thermal stress requirements. This is where High-TG (Glass Transition Temperature) PCBs become the essential standard.
We work closely with Slovak engineering firms, sub-system manufacturers, and global exporters to supply High-TG PCB prototypes and high-volume production runs that comply strictly with both local EU regulations and global automotive quality metrics (IPC-A-600 Class 3, TS16949, and RoHS/REACH directives).
Direct supply paths serving the key hubs of Bratislava, Trnava, Nitra, and Žilina, optimizing transit times and engineering alignment.
Full tracking and compliance certification for CE, RoHS, and REACH requirements, providing hassle-free customs clearance.
Understanding the critical performance metrics of Glass Transition Temperature in severe environments.
The Glass Transition Temperature (Tg) is the thermal point at which a printed circuit board’s base material transition from a rigid, glass-like state to a flexible, rubbery structure. For standard FR-4, this Tg threshold ranges between 130°C and 140°C. However, in industrial power boards, server nodes, and automotive powertrain modules, operating temperatures frequently exceed these limits, calling for High-TG substrates (Tg ≥ 170°C, typical 180°C).
High-TG materials exhibit an extremely low Coefficient of Thermal Expansion (CTE) along the Z-axis. This dramatically reduces the strain on copper vias and plated through-holes (PTHs) during thermal cycling, preventing micro-cracking and electrical open-circuits in multilayer boards.
Delamination is a catastrophic failure mode in multi-layer PCBs. High-TG materials ensure that inter-layer adhesion remains robust even under high-lead-free solder reflow temperatures (reaching up to 260°C) and persistent vibration environments typical of Slovak automotive chassis systems.
Conductive Anodic Filament (CAF) growth is a primary concern for closely spaced traces under humid operating conditions. Our High-TG substrates, blended with high-grade epoxy-resins, offer superior resistance to CAF, preventing short circuits and lengthening assembly lifespans.
| Property Parameter | Standard FR-4 | Medium-TG FR-4 | High-TG FR-4 (Shengyi S1000-2 / Isola equivalent) |
|---|---|---|---|
| Glass Transition Temp (Tg) | 130°C - 140°C | 150°C - 160°C | ≥ 170°C - 180°C |
| Thermal Decomposition Temp (Td) | ≤ 310°C | ≥ 325°C | ≥ 340°C - 360°C |
| Z-Axis Expansion (Before Tg) | ~ 60 ppm/°C | ~ 50 ppm/°C | ~ 40 - 45 ppm/°C |
| Z-Axis Expansion (After Tg) | ~ 270 ppm/°C | ~ 250 ppm/°C | ~ 220 - 240 ppm/°C |
| Time to Delamination (T260) | ~ 5 minutes | ~ 20 minutes | ≥ 60 minutes |
| Time to Delamination (T288) | N/A | ~ 5 minutes | ≥ 15 - 30 minutes |
Ensuring continuous up-time, system-level validation, and extreme thermal resilience in industrial IT setups.
Global manufacturer of high-performance DRAM solutions and specialized industrial PCBs.
Novram Electronics Co., Ltd. is a professional manufacturer based in Shenzhen, China, dedicated to delivering high-performance DRAM solutions and highly engineered circuit board components for global OEM, ODM, and industrial customers. Established in 2016, the company has grown into a reliable supplier of memory modules and robust board-level assemblies, serving partners across consumer electronics, industrial automation, embedded systems, gaming, and enterprise computing.
Operating from a modern 3,860㎡ manufacturing facility, Novram integrates advanced SMT production equipment, strict quality management, and continuous R&D innovation. Our experienced engineering team focuses on developing high-speed, stable, and energy-efficient products for diverse computing and automation applications.
With 9 years of industry experience and 7 years of export experience, Novram exports products to customers in more than 40 countries, including key EU destinations like Slovakia. The company achieves an annual export revenue of approximately US$18.6 million, supported by an efficient global supply chain and responsive customer service.
Quality is at the core of everything we do. Every component undergoes 100% functional testing, compatibility testing, burn-in testing, temperature testing, and aging verification before shipment. Our quality control department consists of 42 professional inspectors, ensuring consistent product performance and long-term reliability.
Novram maintains strong partnerships with over 860 qualified supply chain partners, enabling stable production capacity and reliable component sourcing. Our primary customers include memory module brands, computer manufacturers, industrial PC companies, system integrators, distributors, wholesalers, and OEM/ODM partners worldwide.
Innovation drives our competitiveness. Our dedicated R&D center is staffed by 76 experienced engineers, allowing us to introduce approximately 138 new products each year. We provide comprehensive OEM, ODM, private label, logo printing, packaging customization, capacity customization, firmware optimization, and product specification customization to meet different market requirements.
Factory Facility
R&D Engineers
Professional QA Inspectors
Annual Export Volume
Ensuring reliable delivery and strict compliance to European Union industrial standards.
Through our established logistics network, we offer DDP (Delivered Duty Paid) shipping to all key Slovak regions including Bratislava Technology Park, Nitra North Industrial Zone, and the Žilina Innovation Corridor. We manage all import documentation, customs clearance, and local duties, ensuring that your production scheduling is not disrupted by port delays.
We guarantee compliance with the following standards for all boards shipped into the European Union:
Our Slovak engineering clients benefit from quick Design for Manufacturability (DFM) reviews. Submit your Gerber files and our R&D engineers will run a comprehensive DRC check to optimize stack-up, trace widths, and thermal dissipation via spacing prior to panelization.
We source base copper clad laminates from industry-leading partners (such as Shengyi, Rogers, and Ventec) to guarantee that the mechanical and thermal metrics match datasheet parameters precisely.
Key information regarding technical specifications, sourcing, logistics, and capabilities.
Full collection of hardware components built to high-reliability criteria for Slovak enterprise networks and manufacturing floors.
Get direct access to our engineering team and customize your High-TG PCB panelization schemes.