Novram
| Rigid PCB Manufacturing Capability | Volume Production | Sample Processing | |
|---|---|---|---|
| Layer Count | 1-68L | 64 Layer | |
| Max Thickness | 10mm (394mil) | 14mm (551mil) | |
| Min Line Width/Space | Inner Layer | 2.2mil / 2.2mil | 2.0mil / 2.0mil |
| Outer Layer | 2.5mil / 2.5mil | 2.2mil / 2.2mil | |
| Alignment Capability | Alignment with Core Board | ±25um | ±20um |
| Inner Layer Alignment | ±5mil | ±4mil | |
| Max Copper Weight | 6 oz | 30 oz | |
| Holes Size | Mechanical Drilling | ≥0.15mm (6mil) | ≥0.1mm (4mil) |
| Laser Drilling | 0.1mm (4mil) | 0.050mm (2mil) | |
| Max Size | Unit Size | 850mm x 570mm | 1000mm x 600mm |
| Panel Size | 1250mm x 570mm | 1320mm x 600mm | |
| Aspect Ratio | Unit Size | 20:1 | 28:1 |
| Panel Size | 25:1 | 35:1 | |
| Material Substrates | Lead-Free / Halogen-Free | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| High-Speed PCB Material | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 | ||
| High-Frequency PCB Material | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000 | ||
| Surface Finish | HAL, HAL-LF, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Hard Gold / Soft Gold Plating | ||
| Special Technology | Blind & Buried Holes, Via in Pad, Semi-Plating Holes, Counterbore, Step Mounting Holes, Mixed RF PCB, Busbar PCB | ||
Quality Assurance (QA) Standards:
| Layer Count | Sample Shortest Lead Time | Sample Standard Lead Time | Mass Production Lead Time |
|---|---|---|---|
| 2 Layer | 24 Hours | 3 Days | 6-7 Days |
| 4 Layer | 36 Hours | 5 Days | 8-10 Days |
| 6 Layer | 48 Hours | 5 Days | 8-12 Days |
| 8 Layer | 72 Hours | 5 Days | 9-12 Days |
| 10 Layer | 4 Days | 7 Days | 14 Days |
| 12 Layer | 4 Days | 7 Days | 16 Days |
| 14 Layer | 5 Days | 8 Days | 16 Days |
| 16 Layer | 5 Days | 9 Days | 18 Days |
| 18 Layer | 7 Days | 10 Days | 18 Days |
| 20 Layer & Above | To be negotiated | To be negotiated | To be negotiated |
We manufacture a wide variety of high-density multilayer boards and specialty boards. Our capabilities include multilayer boards (up to 68 layers), impedance control boards, high-frequency/high-speed boards, high TG thick copper boards, buried blind via boards, aluminum-based boards, hybrid dielectric boards, HDI, and rigid-flex boards.
We offer quick-turn-around (QTA) prototype services. 2-layer PCBs can be completed in as short as 24 hours, 4-layer boards in 36 hours, 6-layer boards in 48 hours, and 8-layer boards in 72 hours.
We support a comprehensive list of high-quality materials: Lead-free/Halogen-free (EM827, 370HR, S1000-2, IT180A, etc.), High-Speed (Megtron 6, Megtron 4, Megtron 7, TU872SLK, etc.), High-Frequency (Rogers Ro3003, Ro4350B, Ro4835, Taconic, Genclad, etc.), and specialty materials like Polyimide, LCP, and BT.
Our engineering team accepts RS-274-X & RS-274-D, CAD, DXP, Protel 99 SE, PADS, and GC-CAM file formats for engineering reviews.
We strictly operate under globally recognized quality standards and hold certifications including UL, ISO 9001:2015, ISO 14001:2015, CQC, IATF 16949:2016, and the National Military Standard.
We ship worldwide via multiple channels: express air transport (UPS, DHL, TNT, CTS, and FedEx), railway shipping, seaborne freight, or any shipping method designated by our customers.